Add EasyEDA Pro EPRO2 source ingestion (3/5 batch test)
打通 oshwhub origin=pro 现代 Pro 3.x 工程的 EPRO2 源抓取链路。3/5
modern Pro 项目完整解出（共 8423 docs / 542 MB plain）：
- X86 主板 7374 docs / 481 MB plain (chain=85, editor=3.2.15)
- 220V 桌面电源 771 docs / 26 MB plain (chain=28, editor=3.2.69)
- ESP-VoCat 278 docs / 7.5 MB plain (chain=12, editor=3.2.91)
剩余 2/5 是 legacy Pro 2.x（立创泰山派 RK3566、梁山派），项目 meta
返回 branch_uuid=null + editorVersion="2.1.40"，没有 git-style chain
模型，文档直接挂在 boards[].sch/pcb 字段上，访问端点暂未挖通；元
数据落库 metadata.json，source/ 留空。
实现要点：
- fetch_pro_source(): 4 步流程（project → branch HEAD → structures
→ /branches/<B>/histories/<HEAD> 即返完整 chain，无需 ?limit 批量
端点）+ 逐 history 走 AES-128-GCM 解密（16 字节 IV，pycryptodome
原生支持）+ gunzip + 按 DOCHEAD 切 per-doc EPRO2 流
- EPRO2 解析坑：行末单 `|` 是行终止符不是字段分隔符，必须先
rstrip("|") 再 split("||")，否则 payload JSON 解析失败 silently
swallow 导致 cur_doc 不设 → 第一轮 X86 板 7374 docs 抽出来只剩 2 个
- docType 实测远不止 BOARD/PCB/SCH/SCH_PAGE，还含 SYMBOL /
FOOTPRINT / DEVICE / BLOB / FONT / CONFIG —— Pro 把组件库快照也
随项目存到 history，下游做 EPRO2→KiCad 转换时必须先把这些 lib
doc 加载进 symbol cache
- Pro 2.x vs 3.x 是不同存储模型 —— 3.x 走 branch 模型（已打通），
2.x 走 boards[] 直链（未打通）；判别条件：project meta 的
branch_uuid 是否为 null
CLI 新增 --with-pro-source / --backfill-pro-source / --pro-cookie /
--origin（按 origin 字段服务端过滤 listing API），crawl_one() 按
origin=pro 自动 dispatch 到 Pro fetcher。
schema：docType 类型从 integer 放宽到 [integer, string, null]
（兼容 Std 的 1/3 + Pro 的 BOARD/SCH 等），新增 message_count 字段。
License 注意：本批 5 个项目全是 NC-SA / GPL，未达 Pro source doc
§4.2 Forge 白名单（MIT/BSD/Apache/CC0/CC-BY/CERN-OHL-P/Unlicense）。
按 CLAUDE.md "研究用、不再分发" 原则 raw 入库无碍；Forge 投影时
另过白名单。
详细技术细节见 docs/sources/easyeda_pro_source.md rev 3 + log.md。
Co-Authored-By: Claude Opus 4.7 (1M context) <noreply@anthropic.com>
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{"type":"DOCHEAD","ticket":9535}||{"docType":"DEVICE","client":"d65f147c8efe27cb","uuid":"077db3254ea51c16","updateTime":1759497311437,"version":"1654893714"}|
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{"type":"META","ticket":9536,"id":"META"}||{"title":"0.5-18P立贴","tags":[],"source":"d518db0346aa4a58aed43b84c58b53a7|0819f05c4eef4c71ace90d822a990e87","images":["https://alimg.szlcsc.com/upload/public/product/middle/20230331/491B5E6810EAC130DCCD0B2927C478BE.jpg"],"attributes":{"LCSC Part Name":"间距:0.5mm P数:18P 抽屉式 单侧触点/垂直","Supplier Part":"C61139","Manufacturer":"BOOMELE(博穆精密)","Manufacturer Part":"0.5-18P立贴","Supplier Footprint":"SMD,P=0.5mm(交错脚)","JLCPCB Part Class":"扩展库","Datasheet":"https://atta.szlcsc.com/upload/public/pdf/source/20151208/1457707618552.pdf","Supplier":"LCSC","Add into BOM":"yes","Convert to PCB":"yes","Symbol":"834bf3ba125c564a","Designator":"FPC?","Footprint":"807655f0ccbdc24a","3D Model":"3d5e70db3b5b47e59ba0e6bc9800d5df","3D Model Title":"FPC-SMD_18P-P0.50_L14.5-W3.0-H5.1-C61139","3D Model Transform":"570.865,118.11,0,0,0,0,0,0,0","Locking Feature":"抽屉式","Contact Type":"单侧触点/垂直","Number of Contacts":"18P","Pitch":"0.5mm","Mounting Type":"立贴","FFC, FCB Thickness":"0.3mm","Height Above Board":"5.1mm","Operating Temperature Range":"-25℃~+85℃","Name":"={Manufacturer Part}","Description":"锁定特性:抽屉式;触点类型:单侧触点/垂直;触点数量:18P;间距:0.5mm;安装类型:立贴;工作温度范围:-25℃~+85℃;"}}|
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{"type":"DOCHEAD","ticket":9535}||{"docType":"DEVICE","client":"0fb97aaaf7dbe284","uuid":"077db3254ea51c16","updateTime":1759992873615,"version":"1654893714","user":{"uuid":"215caa123bec401fba5bbdb222b0e772","nickname":"一只不爱吃鱼的猫","username":"liuxiaotao","avatar":"//image.lceda.cn/avatars/2022/8/W4GUor1tCl7FLtACkLdILGxmVP32cSSHlLXizbhS.png"}}|
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{"type":"DOCHEAD","ticket":9535}||{"docType":"DEVICE","client":"0d178074b27f50a0","uuid":"077db3254ea51c16","updateTime":1759993193068,"version":"1654893714","user":{"uuid":"215caa123bec401fba5bbdb222b0e772","nickname":"一只不爱吃鱼的猫","username":"liuxiaotao","avatar":"//image.lceda.cn/avatars/2022/8/W4GUor1tCl7FLtACkLdILGxmVP32cSSHlLXizbhS.png"}}|
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