Files
FacereDataset/data/raw/oshwhub/ba64bd6f1c9c467ba3b674a54943557d/source/957d21abce38481697696490c1eba086.epro2
Knowit 3282a028c4 Add EasyEDA Pro EPRO2 source ingestion (3/5 batch test)
打通 oshwhub origin=pro 现代 Pro 3.x 工程的 EPRO2 源抓取链路。3/5
modern Pro 项目完整解出(共 8423 docs / 542 MB plain):

- X86 主板        7374 docs / 481 MB plain (chain=85, editor=3.2.15)
- 220V 桌面电源     771 docs /  26 MB plain (chain=28, editor=3.2.69)
- ESP-VoCat       278 docs / 7.5 MB plain (chain=12, editor=3.2.91)

剩余 2/5 是 legacy Pro 2.x(立创泰山派 RK3566、梁山派),项目 meta
返回 branch_uuid=null + editorVersion="2.1.40",没有 git-style chain
模型,文档直接挂在 boards[].sch/pcb 字段上,访问端点暂未挖通;元
数据落库 metadata.json,source/ 留空。

实现要点:
- fetch_pro_source(): 4 步流程(project → branch HEAD → structures
  → /branches/<B>/histories/<HEAD> 即返完整 chain,无需 ?limit 批量
  端点)+ 逐 history 走 AES-128-GCM 解密(16 字节 IV,pycryptodome
  原生支持)+ gunzip + 按 DOCHEAD 切 per-doc EPRO2 流
- EPRO2 解析坑:行末单 `|` 是行终止符不是字段分隔符,必须先
  rstrip("|") 再 split("||"),否则 payload JSON 解析失败 silently
  swallow 导致 cur_doc 不设 → 第一轮 X86 板 7374 docs 抽出来只剩 2 个
- docType 实测远不止 BOARD/PCB/SCH/SCH_PAGE,还含 SYMBOL /
  FOOTPRINT / DEVICE / BLOB / FONT / CONFIG —— Pro 把组件库快照也
  随项目存到 history,下游做 EPRO2→KiCad 转换时必须先把这些 lib
  doc 加载进 symbol cache
- Pro 2.x vs 3.x 是不同存储模型 —— 3.x 走 branch 模型(已打通),
  2.x 走 boards[] 直链(未打通);判别条件:project meta 的
  branch_uuid 是否为 null

CLI 新增 --with-pro-source / --backfill-pro-source / --pro-cookie /
--origin(按 origin 字段服务端过滤 listing API),crawl_one() 按
origin=pro 自动 dispatch 到 Pro fetcher。

schema:docType 类型从 integer 放宽到 [integer, string, null]
(兼容 Std 的 1/3 + Pro 的 BOARD/SCH 等),新增 message_count 字段。

License 注意:本批 5 个项目全是 NC-SA / GPL,未达 Pro source doc
§4.2 Forge 白名单(MIT/BSD/Apache/CC0/CC-BY/CERN-OHL-P/Unlicense)。
按 CLAUDE.md "研究用、不再分发" 原则 raw 入库无碍;Forge 投影时
另过白名单。

详细技术细节见 docs/sources/easyeda_pro_source.md rev 3 + log.md。

Co-Authored-By: Claude Opus 4.7 (1M context) <noreply@anthropic.com>
2026-04-28 21:45:52 +08:00

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{"type":"DOCHEAD","ticket":621}||{"docType":"DEVICE","client":"0bb2c9fe-c897-4bff-b46c-eaa1f7c27461","uuid":"957d21abce38481697696490c1eba086","updateTime":1749545744000,"version":"1699408804","editVersion":"3.2.91","user":{"uuid":"16555ec60452466ea4dbaa7c6b92cd89","nickname":"乐鑫小铁匠","username":"esp-college","avatar":"//image.lceda.cn/avatars/2023/7/DgnM9iWggXtWZa70BQwJnpb1x7P2etO5s7i6vqxp.png"}}|
{"type":"DOCHEAD","ticket":622}||{"docType":"DEVICE","client":"0bb2c9fe-c897-4bff-b46c-eaa1f7c27461","uuid":"957d21abce38481697696490c1eba086","updateTime":1749545744000,"version":"1699408804","editVersion":"3.2.91","user":{"uuid":"16555ec60452466ea4dbaa7c6b92cd89","nickname":"乐鑫小铁匠","username":"esp-college","avatar":"//image.lceda.cn/avatars/2023/7/DgnM9iWggXtWZa70BQwJnpb1x7P2etO5s7i6vqxp.png"}}|
{"type":"META","ticket":623,"id":"META"}||{"title":"8.03A0.039200","tags":["连接器","FFC/FPC连接器"],"source":"1f08b44d961a4d8dac5e98292e4fae2e|0819f05c4eef4c71ace90d822a990e87","images":["https://alimg.szlcsc.com/upload/public/product/middle/20231115/E3362481037D7C7BA82C6FC7DF1A5DBF.jpg"],"attributes":{"LCSC Part Name":"间距:0.3mm P数:39P 双侧触点/上下接","Supplier Part":"C19188829","Manufacturer":"DIANWEI(钿威科技)","Manufacturer Part":"8.03A0.039200","Supplier Footprint":"SMD,P=0.3mm,卧贴","JLCPCB Part Class":"","Datasheet":"https://atta.szlcsc.com/upload/public/pdf/source/20231102/9A93F6DBF8D7E3F45D63C4C74E857E9A.pdf","Supplier":"LCSC","Add into BOM":"yes","Convert to PCB":"yes","Symbol":"283eb73e7eef461ca34d625a5a37a5b0","Designator":"U?","Footprint":"76dfd7782a5046119507c13dfe81b12e","3D Model":"c73ad0a7c5f943828584be6ecf349d81","3D Model Title":"FPC-SMD_39P-P0.60_DIANWEI_8.03A0.039200","3D Model Transform":"523.621,161.417,0,0,0,0,0,9.055,0","Contact Type":"双侧触点/上下接","Number of Contacts":"39P","Pitch":"0.3mm","FFC, FCB Thickness":"0.2mm","Height Above Board":"0.9mm","Contact Material":"铜合金","Contact Plating":"金","Operating Temperature Range":"-40℃~+80℃","Soldering Temperature(Max)":"260℃","Name":"={Manufacturer Part}","Description":"触点类型:双侧触点/上下接;触点数量:39P;间距:0.3mm;工作温度范围:-40℃~+80℃;焊接温度(最大值):260℃;"}}|